DIELINE SUMMIT DESIGN PACKAGING CONGRESS

Launched jointly by the international EMBALLAGE exhibition and The Dieline, the first edition of "The Dieline Summit" - will be held at the Palais des Congrès in Paris on the 16th and 17th November. This one-of-a-kind forum is inspired by the theme "WHAT IS THE FUTURE OF PACKAGE DESIGN?" It is aimed at professional designers, and packaging enthusiasts, aiming to reinvent packaging design in the presence of some of the sector's leading stakeholders.